Researchers earn DesignCon best paper award

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On March 7, 2023

Dr. DongHyun Kim, assistant professor of electrical and computer engineering, along with graduate students Yuanzhuo Liu, Yuandong Guo and Chaofeng Li, won the DesignCon 2022 Early-Career Best Paper Award at DesignCon 2023 in February. The paper is titled “Integration-based Method for Surface Roughness Modeling of Copper Foils.” This work was done in collaboration with Intel Corporation in Hillsboro, Oregon.

DesignCon is an international conference for chip, board and systems designers in high-speed communications and semiconductor fields. It introduced the Best Early Career Paper Award in 2022 to recognize excellence in technical papers. Kim and his group has won technical DesignCon awards for three consecutive years.

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On March 7, 2023. Posted in Accomplishments