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Scott Grier, a senior in civil engineering and engineering management, will spend his Fall 2019 semester in Hong Kong as a recipient of the Benjamin A. Gilman International Scholarship to study abroad. The scholarship allows Grier to participate in academic and cultural experiences while studying structural engineering at Hong Kong University of Science and Technology.
“The idea of spending a semester in another country and an environment so different from what I am used to seems like the ultimate adventure,” Grier says. “I am excited to experience the culture and learn more about how people interact in Hong Kong, and how that differs from what I am used to being from the Midwest in the United States. This scholarship will help as I am studying abroad to allow me to experience things more fully and worry less about the costs.”
The Gilman Scholarship program supports students who have been historically underrepresented in education abroad, including those students in science, technology, engineering and mathematics (STEM) fields. More than 1,300 U.S. institutions have sent more than 28,000 Gilman scholars to nearly 150 countries around the globe.